Type 3 – Multilayer Flex: Also uses plated through-holes between layers with conductor allowed on all layers. Type 2 – Double-layer Flex: Uses two conductive layers with plated through holes. Type 1 – Single-layer Flex: Uses one conductive layer uncovered on one side or laminated between insulating layers. The IPC-6013 standard defines four types of stackups for flex and rigid-flex boards: If you need more advanced capabilities than what you’ll find in FR4 laminates, there are many alternative PCB materials you can use in your design. One important point to understand is the difference between core and prepreg materials in any PCB stackup. Make sure to select the right dielectric materials for your PCB and set the thickness needed to ensure you comply with your fabricator’s design requirements. As you work with rigid-flex designs, you can balance the mechanical and electronic design areas by using the surface of an imported 3D STEP model to redefine the board shape. You can also use Board Shape to split power planes and define the boundaries of the power planes. The Board Shape tool also allows you to split the printed circuit boards into multiple board regions and place bending lines on a flex board region. Alternatively, you can use the board shape editor to customize the dimensions and shape of your PCB. One option is to import a DXF file into a mechanical layer and use this to define the board shape. When working in Altium Designer’s PCB Editor, you can define the board shape area available for components and routing. Altium Designer provides the essential tools needed to create a PCB 4-layer stackup in standard rigid boards, rigid-flex boards, and multilayer board assemblies.Įasily Define the Form Factor with Circuit Board ShapeĪfter designing the stackup for your 4-layer board, it’s time to define the board shape before component placement. Instead of guessing at the right layer count, dielectric constant, and loss tangent to define in your PCB, use the best PCB design tools in Altium Designer to implement your fabricator requirements. This stackup is rather simple and can be reliably fabricated as long as the basic layer thickness and layer arrangement requirements are met. Every PCB stackup needs to be built to consider fabrication capabilities, available materials, and target impedance, and it’s your fabricator’s job to provide the PCB stackup specification for your layer count.Ī 4-layer PCB stackup is the most common multilayer PCB stackup used in modern electronics. However, you would be surprised at the number of PCB stackups that need to be modified before beginning full-scale production. Whenever you start a PCB design project, it’s likely that your last instinct is to contact your fabricator about their stackup requirements.
A PCB design software package with stackup design features for professional PCB layout engineers.